招贤纳士

人才招聘

2021-7-8 Sr. Mechanical Engineering 上海 薪资面议

l Job Responsibilities:

§ Establish requirements for semiconductor equipment systems and components
§ Organize, participate, and lead in the feasibility studies, conceptualization, modeling, analysis, development, documentation, and test/validation of hardware associated with new semiconductor equipment
§ Develop and present reports/presentations that communicate design intent, analysis, and validation at executive-level meetings
§ Lead multi-disciplinary development teams, serve as an expert resource for a product or technical area, and directly support personnel in the preparation of detailed design, design testing and prototype fabrication
§ Analyze designs developed – may need to perform structural analysis (FEA), thermal and fluid flow analysis, and Failure Modes and Effects Analysis (FMEA)
§ Lead problem solving teams including root cause identification, brainstorming and conceptual development
§ Work with potential suppliers to ensure parts can be manufactured in accordance with performance and cost objectives
§ Provide on-job training (OJT) for other engineers

l Qualifications:

§ Engineering background with thermal designs and/or RF system designs coupled with solid engineering skills
§ Minimum of 12 years related engineering experience with a Bachelor’s degree; or 8 years and a Master’s degree; or a PhD with 5 years’ experience; or equivalent experience
§ Extremely knowledgeable using 3D-CAD tools, strong hands-on experimental and design capability
§ Excellent presentation skills; present progress on large cross-functional initiatives at executive-level meetings
§ Strong skills and experiences in problem solving, time and priority management, communication, and project management

l Preferred Qualifications:

Semiconductor industry experience is not required, but a plus

2021-7-8 Sr. Mechanical Engineering 北京 薪资面议

l Job Responsibilities:

§ Establish requirements for semiconductor equipment systems and components
§ Organize, participate, and lead in the feasibility studies, conceptualization, modeling, analysis, development, documentation, and test/validation of hardware associated with new semiconductor equipment
§ Develop and present reports/presentations that communicate design intent, analysis, and validation at executive-level meetings
§ Lead multi-disciplinary development teams, serve as an expert resource for a product or technical area, and directly support personnel in the preparation of detailed design, design testing and prototype fabrication
§ Analyze designs developed – may need to perform structural analysis (FEA), thermal and fluid flow analysis, and Failure Modes and Effects Analysis (FMEA)
§ Lead problem solving teams including root cause identification, brainstorming and conceptual development
§ Work with potential suppliers to ensure parts can be manufactured in accordance with performance and cost objectives
§ Provide on-job training (OJT) for other engineers

l Qualifications:

§ Engineering background with thermal designs and/or RF system designs coupled with solid engineering skills
§ Minimum of 12 years related engineering experience with a Bachelor’s degree; or 8 years and a Master’s degree; or a PhD with 5 years’ experience; or equivalent experience
§ Extremely knowledgeable using 3D-CAD tools, strong hands-on experimental and design capability
§ Excellent presentation skills; present progress on large cross-functional initiatives at executive-level meetings
§ Strong skills and experiences in problem solving, time and priority management, communication, and project management

l Preferred Qualifications:

Semiconductor industry experience is not required, but a plus

  • 微信公众号
COPYRIGHT 2021 拓荆科技股份有限公司 All RIGHTS RESERVED. 技术支持:优诺科技辽ICP备05007152号-1